Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2005-11-29
2005-11-29
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C438S597000, C205S080000, C205S081000, C205S082000, C205S083000, C205S084000, C427S523000, C427S531000
Reexamination Certificate
active
06969672
ABSTRACT:
A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether the measured thickness of the conductive layer is within a predetermined tolerance, and revising the deposition recipe if the thickness of the conductive layer is not within the predetermined tolerance. An apparatus includes a deposition unit capable of depositing a conductive layer according to a deposition recipe; a thickness measuring unit capable of measuring at least one thickness of the conductive layer and outputting thickness data; and a deposition control unit capable of receiving the thickness data from the thickness measuring unit, determining whether the thickness data is within a predetermined tolerance, revising the deposition recipe if the thickness data is not within the predetermined tolerance, and outputting the revised deposition recipe.
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Hewett Joyce S. Obey
Pasadyn Alexander James
Advanced Micro Devices , Inc.
Coleman W. David
Nguyen Khiem D.
Williams Morgan & Amerson
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