Method and apparatus for controlling a temperature of a polishin

Details Method and apparatus for controlling a temperature of a polishin Method and apparatus for controlling a temperature of a polishin

1997-12-18

1999-09-28

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

451 21, 451 41, 451 56, 451287, 451443, B24B 500

Patent

active

059577509

ABSTRACT:
A method and apparatus for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface soften and/or become more soluble, and/or material comprising the planarizing surface attains approximately its glass transition temperature. The waste matter accumulations and/or a portion of the planarizing surface are in this way softened and more easily removed. The planarizing surface is either heated directly by directing a flow of heated planarizing liquid or heated air to the planarizing surface or indirectly by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.

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Li, Weidan et al., "The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO.sub.2 films" Thin Solid Films, 270, 1995, pp. 601-606.

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