Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2005-01-04
2005-01-04
Nguyen, George (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S021000, C451S041000, C451S056000
Reexamination Certificate
active
06837773
ABSTRACT:
A method and apparatus for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface soften and/or become more soluble, and/or material comprising the planarizing surface attains approximately its glass transition temperature. The waste matter accumulations and/or a portion of the planarizing surface are in this way softened and more easily removed. The planarizing surface is either heated directly by directing a flow of heated planarizing liquid or heated air to the planarizing surface or indirectly by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.
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Li, Weidan et al., “The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2films,”Thin Solid Films, 270, 1995, pp. 601-606.
Dorsey & Whitney LLP
Micro)n Technology, Inc.
Nguyen George
LandOfFree
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