Method and apparatus for controlled deformation bonding

Details Method and apparatus for controlled deformation bonding Method and apparatus for controlled deformation bonding

1992-07-06

1993-08-31

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

22818021, 228 62, 228 9, 228 447, B23K 2000, H01L 21603

Patent

active

052401650

ABSTRACT:
A method of producing reliable bonds of a lead to a bump on a semiconductor chip is accomplished by controlling the amount of deformation of the lead and the bump during bonding. A differential amplifier is used to sense the deformation and stop the application of force to the lead and the bump when a desired amount of deformation of the lead and the bump is obtained.

REFERENCES:
patent: 3713575 (1973-01-01), Cushman
patent: 3914850 (1975-10-01), Coucoulas
patent: 4918277 (1990-04-01), Zimmer
patent: 4984730 (1991-01-01), Gobel et al.
patent: 5094382 (1992-03-01), Shimizu

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