Metal fusion bonding – Including means to apply flux or filler to work or applicator
Reexamination Certificate
2005-07-05
2005-07-05
Cooke, Colleen P. (Department: 1754)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
C228S013000
Reexamination Certificate
active
06913182
ABSTRACT:
Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. The apparatus consists of a precise orifice with a surrounding air passage for atomizing and focusing the flux at a discrete location on the surface. Controls are incorporated for selecting, controlling and monitoring the flux deposition amount and location, for coordinating with the transport motion system, for integrating with the adjacent air flow and for selecting the atomized or non-atomized method of application.
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Precision Solder, Inc., “ServoFlux System, JetFlux Plus Technology, Servo Actuator Transport Spray Flux System,” 2002.
Precision Solder, Inc., “ServoFlux System, JetFlux Plus Patented Technology, Dual Servo Actuator Selective Spray Flux System,” 2002.
Fay Sharpe Fagan Minnich & McKee LLP
Precision Dispensing Equipment, Inc.
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