Method and apparatus for contour multi-level embossing with perf

Printing – Embossing or penetrating – Rolling-contact machines

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428133, B31F 107

Patent

active

057274584

ABSTRACT:
An embossing apparatus and method which provides a better embossed appearance and eliminates undesired roughness on the backside of the web material. Two plies are multilevel embossed between rigid engraved rolls and backup rolls, which may be either engraved or smooth. One rigid roll has embossing elements of varying heights and perforation elements, which run in a side-by-side relationship with the corresponding perforation elements on the opposing rigid roll in a nip region of the apparatus. The multiple plies are perforation bonded between the perforation elements, which are preferably the two highest elements, thus reinforcing the other multi-level embossed pattern formed in between the perforation bonds. The embossed patterns impart a quilt-like contoured appearance to the finished product.

REFERENCES:
patent: 2931748 (1960-04-01), Muller
patent: 3323983 (1967-06-01), Palmer et al.
patent: 3953638 (1976-04-01), Kemp
patent: 4307141 (1981-12-01), Walbrun
patent: 4320162 (1982-03-01), Schulz
patent: 4543142 (1985-09-01), Kuepper et al.
patent: 4758297 (1988-07-01), Calligarich
patent: 4921034 (1990-05-01), Burgess et al.
patent: 5066531 (1991-11-01), Legg
patent: 5269983 (1993-12-01), Schulz

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for contour multi-level embossing with perf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for contour multi-level embossing with perf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for contour multi-level embossing with perf will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-948999

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.