Method and apparatus for continuous processing of semiconductor

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate

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205143, 205157, 205656, 205686, 205687, 204202, 204212, 204224R, 204224M, C25D 712, C25D 900, C25D 1700, C25F 700

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058939660

ABSTRACT:
An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.

REFERENCES:
patent: 2495695 (1950-01-01), Camin et al.
patent: 3161576 (1964-12-01), Teichner
patent: 3161578 (1964-12-01), Facquet et al.
patent: 3522087 (1970-07-01), Lacal
patent: 3580827 (1971-05-01), Lannegrace
patent: 3714011 (1973-01-01), Grosso et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4592816 (1986-06-01), Emmons et al.
patent: 4696729 (1987-09-01), Santini
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5198089 (1993-03-01), Brueggman
patent: 5273642 (1993-12-01), Crites et al.
patent: 5403458 (1995-04-01), Hartig et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5437777 (1995-08-01), Kishi
patent: 5441629 (1995-08-01), Kosaki
patent: 5447615 (1995-09-01), Ishida
patent: 5472592 (1995-12-01), Lowery
patent: 5516412 (1996-05-01), Andricacos et al.

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