Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1995-03-31
1995-10-10
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
1566271, 216 86, C23F 102
Patent
active
054567882
ABSTRACT:
A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing a base member having a reference surface; releasably securing the workpiece to the base member; providing at least two sensors disposed on the base member to be proximate to but not in contact with the outer perimeter of the workpiece surface; and monitoring an electrical characteristic between said at least two sensors, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process.
REFERENCES:
patent: 2933675 (1960-04-01), Hoelzle
patent: 3163568 (1961-02-01), Mieux
patent: 3553052 (1971-01-01), Jubb, Jr.
patent: 3874959 (1975-04-01), Hoekstra
patent: 3959046 (1976-05-01), Bussmann et al.
patent: 3964956 (1976-06-01), Snyder
patent: 4338157 (1982-07-01), Kanda
patent: 4497699 (1985-02-01), de Wit et al.
patent: 4621037 (1986-11-01), Kanda et al.
patent: 4755442 (1988-07-01), Hasebe et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4969973 (1990-11-01), Rinck et al.
patent: 4995939 (1991-02-01), Ferenczi et al.
patent: 5071508 (1991-12-01), Scheithauer
patent: 5081421 (1992-01-01), Miller et al.
patent: 5198072 (1993-03-01), Gabriel
patent: 5338390 (1994-08-01), Barbee et al.
Goubau, W. M., "Capacitive Etch Rate Monitor for Dielectric Etching", IBM Technical Disc. Bulletin vol. 31, No. 1, Jun. 1988, 448-449.
Liu et al., "Resistance/Capacitance Methods for Determining Oxide Etch End Point", IBM Technical Disc. Bulletin vol. 16, No. 8, Jan. 1974, 2706-2707.
Hoekstra, J. P., "Establishing End Point During Delineation Process", IBM Technical Disc. Bulletin vol. 16, No. 6, Nov. 1973, 1717-1720.
Bassous et al., "An In-Situ Etch Rate Monitor Controller", IBM Technical Disc. Bulletin vol. 20, No. 3, Aug. 1977, 1232-1234.
Barbee Steven G.
Datta Madhav
Heinz Tony F.
Li Leping
Ratzlaff Eugene H.
Breneman R. Bruce
Chang Joni Y.
International Business Machines - Corporation
Mortinger Alison D.
LandOfFree
Method and apparatus for contactless real-time in-situ monitorin does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for contactless real-time in-situ monitorin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for contactless real-time in-situ monitorin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2308332