Method and apparatus for contact resistance measurement

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07061256

ABSTRACT:
A contact resistance measurement method is composed of: placing a first probe onto a first pad connected to an integrated circuit; placing a second probe onto a second pad electrically connected to the first pad; placing a third probe onto a third pad electrically connected to the first pad; measuring a first resistance between the first and second probes; measuring a second resistance between the second and third probes; measuring a third resistance between the third and first probes. A contact resistance between the first probe and the first pad is calculated from the first to third resistances.

REFERENCES:
patent: 3692987 (1972-09-01), Bos
patent: 3758745 (1973-09-01), Wilker et al.
patent: 4876515 (1989-10-01), Ball
patent: 5446395 (1995-08-01), Goto
patent: 5715147 (1998-02-01), Nagano
patent: 6674295 (2004-01-01), Kamitani
patent: 2-251162 (1990-10-01), None
patent: 8-330368 (1996-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for contact resistance measurement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for contact resistance measurement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for contact resistance measurement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3643274

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.