Method and apparatus for conditioning of chemical-mechanical pol

Details Method and apparatus for conditioning of chemical-mechanical pol Method and apparatus for conditioning of chemical-mechanical pol

1995-09-29

1997-03-18

Kunemund, Robert

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

1566361, 156345, 451444, 451259, 451287, B24B 2900

Patent

active

056119437

ABSTRACT:
A method and apparatus for conditioning and/or rinsing a pad in a chemical-mechanical polisher. A scoring apparatus is rotated about its center directly over the polishing pad of the chemical-mechanical polisher. The scoring apparatus scores the pad surface while rotating above the pad. Consequently the pad is conditioned in a uniform and concentric fashion.

REFERENCES:
patent: 2826009 (1958-03-01), Shurson
patent: 4481738 (1984-11-01), Tabuchi
patent: 4839993 (1989-06-01), Masuko et al.
patent: 4984390 (1991-01-01), Kobayashi
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5547417 (1996-08-01), Breivogel et al.

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