Method and apparatus for conditioning a transmission path...

Details Method and apparatus for conditioning a transmission path... Method and apparatus for conditioning a transmission path...

2005-11-09

2009-12-01

Li, Shi K (Department: 2613)

Optical communications

Hybrid communication system

C398S130000

Reexamination Certificate

active

07627249

ABSTRACT:
A method and apparatus for conditioning a wireless data communication path for the transmission of a signal wave are presented. The apparatus comprises a conditioning wave transmitter positioned to transmit a conditioning wave along at least a portion of the wireless data communication path. The conditioning wave forms a conditioning envelope about the data communication path. The wavelength of the conditioning wave is selected to remove undesirable particles from the wireless data communication path. As a result, the wireless data communication path is conditioned to provide for improved data communication. The conditioning wave may be transmitted co-, counter-, or bi-directionally with respect to the signal wave, and may form a second data channel.

REFERENCES:
patent: 5053783 (1991-10-01), Papadopoulos
patent: 6028686 (2000-02-01), Mirell et al.
patent: 6111237 (2000-08-01), Paustian
patent: 6377436 (2002-04-01), Margolin
patent: 6462847 (2002-10-01), Willebrand
patent: 6490066 (2002-12-01), Korevaar
patent: 6643467 (2003-11-01), Presby et al.
patent: 1136032 (1968-12-01), None
D. Smith, “High-Power Laser Propagation: Thermal Blooming”, Proceedings of the IEEE, vol. 65, No. 12, Dec. 1977.

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