Method and apparatus for conditioning a polishing pad

Details Method and apparatus for conditioning a polishing pad Method and apparatus for conditioning a polishing pad

2007-02-13

2007-02-13

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S285000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

11110327

ABSTRACT:
A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess material from the wafer, allowing an efficient polishing of the surface of the wafer. The polishing pad smoothes out due to the polishing of the wafer and must be conditioned to restore effectiveness. A conditioning assembly with a plurality of diamonds is provided. The diamonds have predetermined angles that provide strength to the diamond. This allows for an optimal rotation speed and downward force in effective conditioning of the polishing pad, while reducing diamond fracture rate.

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Rohm Haas, DiaGrid Pad Conditioners, Mar. 2005.
PCT Int'l. Search Report, Int'l. Application No. PCT/US2005/024890, Int'l. filing date Jul. 15, 2005, mailing date Oct. 13, 2005, 12 pages.

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