Method and apparatus for conditioning a polishing pad

Details Method and apparatus for conditioning a polishing pad Method and apparatus for conditioning a polishing pad

2005-05-24

2005-05-24

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S056000, C451S285000

Reexamination Certificate

active

06896583

ABSTRACT:
A method (60) for conditioning a polishing pad (20) used for polishing semiconductor wafers (14). The degradation in conditioning performance of a conditioning device (28) is accounted for by controlling at least one of the conditioning velocity (64), conditioning down force (66) and conditioning time (68). The amount of the degradation of conditioning performance during consecutive uses of a conditioning device (28) may be determined by measuring the friction force (72) between the conditioning device (28) and the polishing pad (20), or it may be predicted on the basis of an algorithm (82) developed from data obtained from a plurality of representative conditioning devices (80).

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