Abrading – Accessory – Tool cleaner
Reexamination Certificate
2007-09-11
2007-09-11
Wilson, Lee D. (Department: 3723)
Abrading
Accessory
Tool cleaner
C451S028000, C451S027000, C451S030000, C451S056000, C451S443000, C451S446000, C451S526000, C451S532000, C451S536000, C451S539000
Reexamination Certificate
active
10728526
ABSTRACT:
A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
REFERENCES:
patent: 4132534 (1979-01-01), Valdsaar
patent: 4232059 (1980-11-01), Proffitt
patent: 4475983 (1984-10-01), Bader et al.
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5399234 (1995-03-01), Yu et al.
patent: 5667541 (1997-09-01), Klun et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5851138 (1998-12-01), Hempel, Jr.
patent: 5868608 (1999-02-01), Allman et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5890951 (1999-04-01), Vu
patent: 5913715 (1999-06-01), Kirchner et al.
patent: 5921856 (1999-07-01), Zimmer
patent: 5941761 (1999-08-01), Nagahara et al.
patent: 5941762 (1999-08-01), Ravkin et al.
patent: 6004196 (1999-12-01), Doan et al.
patent: 6022266 (2000-02-01), Bullard et al.
patent: 6027659 (2000-02-01), Billett
patent: 6054183 (2000-04-01), Zimmer et al.
patent: 6273798 (2001-08-01), Berman
patent: 6352471 (2002-03-01), Bange et al.
patent: 6386963 (2002-05-01), Kenji et al.
patent: 6447374 (2002-09-01), Sommer et al.
patent: 6447375 (2002-09-01), Yancey et al.
patent: 6679761 (2004-01-01), Sunahara et al.
patent: 6935928 (2005-08-01), Uchikura et al.
patent: 2001/0008828 (2001-07-01), Uchikura et al.
McDonald Shantese
Micro)n Technology, Inc.
TraskBritt
Wilson Lee D.
LandOfFree
Method and apparatus for conditioning a chemical-mechanical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for conditioning a chemical-mechanical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for conditioning a chemical-mechanical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3762929