Method and apparatus for coating the top of an electrical device

Details Method and apparatus for coating the top of an electrical device Method and apparatus for coating the top of an electrical device

1990-06-18

1994-08-02

Jones, W. Gary

Coating apparatus

With heat exchange, drying, or non-coating gas or vapor...

With solid heat exchange means contacting work

118407, 118410, 118415, B05C 1100, B05C 502, B05C 309

Patent

active

053342453

ABSTRACT:
A method and apparatus for dispensing a thin coating of a highly viscous encapsulant liquid on to the top surface of a semiconductor device having been inner lead bonded. The coating is dispensed with a controlled thickness and is substantially planar. A liquid encapsulant having optimum thermal, chemical and mechanical properties is selected for protecting the electrical device and which is suitably controlled in an automated liquid dispensed process. The process is directed to various parameters which are required for achieving the desired quality, reliability, and automatic processing capability.

REFERENCES:
patent: 4609037 (1986-09-01), Wheeler et al.
patent: 4721453 (1988-01-01), Belanger, Jr.
patent: 4824006 (1989-04-01), Shimizu

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