Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1986-07-17
1989-02-21
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427185, 427195, 118429, 118620, 118DIG5, B05D 314
Patent
active
048063886
ABSTRACT:
A method and apparatus for applying a synthetic resin layer to an outer surface of a metal part while the metal part is placed within a powdered mass of a thermally fusible synthetic resin. The metal part within the powdered mass is induction-heated to a temperature higher than a melting point and lower than a thermal decomposition point of the synthetic resin, in order to melt a portion of the powdered mass surrounding the heated metal part, and thereby permit the molten portion of the powdered mass to be deposited as the synthetic resin layer on the outer surface of the heated metal part. To facilitate the placement of the metal part in the powdered mass, air may be blown into the powdered mass to keep the mass in a fluid state.
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Iwase Takahiro
Kobayashi Nobuo
Masuda Naofumi
Mochizuki Hiroyuki
Taguchi Yoshio
Bashore Alain
Beck Shrive
Toyota Jidosha & Kabushiki Kaisha
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