Coating processes – Coating by vapor – gas – or smoke – Moving the base
Patent
1985-01-18
1987-05-05
Lusignan, Michael R.
Coating processes
Coating by vapor, gas, or smoke
Moving the base
118 62, 118 63, 118314, 118316, 156646, 427294, 4274345, B44C 122, B05D 118, C23C 1400, C23C 1600
Patent
active
046631976
DESCRIPTION:
BRIEF SUMMARY
The invention relates to a method and apparatus to apply a film of fluid medium on a surface. Thereby use is made of submicro-filtered gaseous environment for this surface during the applying of such a film.
The substrates, processed in that way, can be used in the micro-electronica with the processing of silicon wafers and the like.
In the Dutch Patent Application No. 8 101 440 of the Applicant an apparatus is disclosed for the applying of fluid medium on a substrate, whereby a guide wall has been used, along which the surface of the substrate to be processed is displaceable under direct contact with the wall, before in the process section medium is fed to this substrate. Thereby under vacuum force such substrate is urged against this wall. By extending the outlets of the fluid media towards near the extension of this guide wall a micro passage is obtained between the separation walls of such outlets and the substrate, in which passage media can flow along this substrate to the discharge channel.
The disadvantages of the apparatus with guide walls for the substrates are the following: wall submicro particles can be moved from this substrate and as a contamination affect the applied coating. medium can be suctioned on and seal off these channels. take its original shape, altera due to deformation thereof by touching of the passage wall of the cabin. passage and consequently variations in supply and discharge of the media. touched.
With the apparatus and method according to the invention these shortcomings are eliminated. Thereby the creation and maintaining of such media cushion in the passage aside the substrates, that at least the central section of such substrates cannot touch the wall of the supply- and discharge channels.
The substrates, used in the micro-electronica, have very small variations in the thickness and have narrow tolerances in unflatness and bow. Consequently, the passage sections aside thee substrates can be very narrow with a corresponding low consumption of media to maintain uch cushion. The very limited height of the media cushions enables a large force of process media on the substrates with consequently a strong whirling action in these passage sections of the media. Due to this whirling action the processing is very intensive and so the length of processing is restricted. Also a continuous displacement of the substrates is posssible during the processing.
The consumption of fluids and gaseous medium per substrate processed is limited and completely allowable in view of the high cost price of such substrates.
Further details regarding the apparatus and method follow from the description of the following figures:
FIG. 1 is an enlarged perspective detail of the cabin, through which by means of micro media cushions the substrates are transported without contact with the environment.
FIG. 2 is a vertical cross section of an apparatus, in which the cabin according to FIG. 1 is used.
FIG. 3 is a horizontal cross section of the apparatus according to FIG. 2.
FIG. 4 is an enlarged fragmentary detail of the cross section according to FIG. 2 at the inlet section thereof.
FIG. 5 is an enlarged detail of the cross section according to FIG. 2 at the discharge section thereof.
FIG. 6 shows a segment package with supply- and discharge channels.
FIG. 7 is a partial cross section of the apparatus according to FIG. 2, in which over two segments supply channels for gaseous medium are shown.
FIG. 8 is a longitudinal cross section of the segment according to FIG. 7.
FIG. 9 is an enlarged detail of the segment according to FIG. 8.
FIG. 10 is a cross section of the apparatus according to FIG. 2 with supply- and discharge channels for various media.
FIG. 10A is an enlarged fragmentary side elevation of the cabin according to FIG. 2.
FIG. 11 is a side view of a segment, in which discharge channels for media are located.
FIG. 12 is a cross section over line 12--12 of the segment according to FIG. 11.
FIG. 13 is a side view of a segment, in which channels for fluid medium are positioned.
FIG. 14 is a cross s
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Integrated Automation Limited
Lusignan Michael R.
Olsen Warren E.
Semmes David H.
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