Method and apparatus for cleaving wafers

Details Method and apparatus for cleaving wafers Method and apparatus for cleaving wafers

1989-09-13

1991-02-26

Phan, Hien H.

Severing by tearing or breaking

Methods

With preliminary weakening

225 9605, 225103, 225105, B26F 300, B28D 500

Patent

active

049955390

ABSTRACT:
A method and apparatus for breaking a scribed workpiece such as a semiconductor wafer is taught. Briefly stated, the semiconductor wafer is disposed between two elastomeric foils, one of which is adhesively attached to the side of the workpiece which is not scribed. The foils are stretched and a force is then applied to the sandwich so that the workpiece breaks along the scribed lines. Due to the elastomeric nature of the foils the broken pieces separate slightly and remain separated after breaking, thereby preventing damage to adjacent surfaces of the workpiece.

REFERENCES:
patent: 3396452 (1968-08-01), Sato et al.
patent: 3537169 (1970-11-01), Eigeman et al.
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3567791 (1972-04-01), Hobbs
patent: 3667661 (1972-06-01), Farmer
patent: 3677875 (1972-07-01), Althouse
patent: 3790051 (1974-02-01), Moore
patent: 3920168 (1975-11-01), Regan et al.
IBM TDB, vol. 23, No. 10, Mar. 1981, pp. 4749, 4750.

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