Method and apparatus for cleaving a wafer through expansion...

Details Method and apparatus for cleaving a wafer through expansion... Method and apparatus for cleaving a wafer through expansion...

2007-11-13

2007-11-13

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21499, C083S015000, C225S093000

Reexamination Certificate

active

11072331

ABSTRACT:
A starting point for cleavage made up of at least one of a groove and a through hole is formed on a chip dividing line or a dicing line along the cleaved surface of a wafer. Liquid matter is injected into the starting point. Then, the liquid matter is changed by applying an external factor that changes the liquid matter physically. Making use of the change, the wafer is cleaved so as to divide the wafer into semiconductor chips.

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Notification of Reasons for Rejection in the First Examination issued by the State Intellectual Property Office of the People's Republic of China, dated Jan. 26, 2007, for Chinese Patent Application No. 200510053418.

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