Method and apparatus for cleaving a semiconductor wafer into ind

Details Method and apparatus for cleaving a semiconductor wafer into ind Method and apparatus for cleaving a semiconductor wafer into ind

1991-12-16

1994-05-10

Jones, Eugenia

Severing by tearing or breaking

Methods

With preliminary weakening

225 965, 29413, B26F 300, H01L 2178

Patent

active

053101049

ABSTRACT:
The invention discloses a novel method and apparatus for cleaving semiconductor wafers into individual die which comprises mounting the wafer upon an adherent resilient air impermeable membrane while the latter is flat. Cleaving is achieved by using air pressure to inflate the membrane to cause bending and tensile stresses on the wafer brought about by its adhesion to the inflating membrane. These stresses cleave the wafer along the scribe marks to form individual die. The die may be easily removed by the application of a vacuum to the underside of the membrane which draws it against a perforated undulatory grid dimensioned according to the die dimensions to reduce the surface contact. This reduces adhesion of the die to the membrane to facilitate a low stress pick-off of the die.

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