Method and apparatus for cleaning slurry depositions from a...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S067000, C451S288000

Reexamination Certificate

active

11205382

ABSTRACT:
Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

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patent: 5779520 (1998-07-01), Hayakawa
patent: 6251001 (2001-06-01), Pinson et al.
patent: 6402598 (2002-06-01), Ahn et al.
patent: 6505636 (2003-01-01), Travis
patent: 6520839 (2003-02-01), Gonzalez-Martin et al.
patent: 6629883 (2003-10-01), Katsuoka et al.
patent: 62-224563 (1987-10-01), None

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