Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2006-06-02
2009-08-11
Carrillo, Sharidan (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S021000, C134S025400, C134S032000, C134S033000, C134S042000, C134S902000, C438S906000
Reexamination Certificate
active
07572342
ABSTRACT:
A system for cleaning semiconductor lithography tools provides for cycling a polished-side down semiconductor wafer through the lithography tool using conventional automated robotics for loading and unloading the wafer from a vacuum chuck of the lithography tool. The vacuum chuck may provide a continuous clamping vacuum feature and may include a vacuum ring that surround the periphery of the vacuum chuck. The chuck and vacuum ring may advantageously be formed of a high accuracy ceramic or plastic such as ZeroDur ceramic. The polished side of the semiconductor wafer includes grooves in a polished surface and which extend inwardly from a peripheral edge of the wafer, the grooves provide gaps between the wafer and chuck allowing the wafer to be released by a slow loss of vacuum-pressure through the gaps. The pristine clean polished surface of the wafer getters contaminating particles from the chuck.
REFERENCES:
patent: 5963315 (1999-10-01), Hiatt et al.
patent: 7045019 (2006-05-01), Hemker et al.
patent: 2004/0084059 (2004-05-01), Xia et al.
patent: 2007/0277851 (2007-12-01), Jacobson
Carrillo Sharidan
Duane Morris LLP
Wafertech LLC
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