Method and apparatus for cleaning and drying a workpiece

Details Method and apparatus for cleaning and drying a workpiece Method and apparatus for cleaning and drying a workpiece

2005-05-17

2005-05-17

Esquivel, Denise L. (Department: 3749)

Drying and gas or vapor contact with solids

Process

By centrifugal force

C034S058000, C034S560000, C134S902000

Reexamination Certificate

active

06892472

ABSTRACT:
A method and apparatus for rinsing and spin-drying a hydrophobic material such as a hydrophobic semiconductor wafer improves wafer drying while at the same time reduces the formation of residual contaminants on the dried surface of the wafer. This is accomplished by first establishing a safe-zone between a minimum rotational speed above which drying proceeds satisfactorily and a maximum rotational speed above which contaminants dry on the wafer's surface. A spin-rate profile can then be adopted such that the rinse/dry process proceeds within the safe zone.

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