Method and apparatus for classifying manufacturing outputs

Details Method and apparatus for classifying manufacturing outputs Method and apparatus for classifying manufacturing outputs

2007-12-25

2007-12-25

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S073000, C702S179000

Reexamination Certificate

active

11292485

ABSTRACT:
A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calculated. The outputs are then grouped based on the Euclidean distances that satisfy a boundary determining criterion.

REFERENCES:
patent: 5442562 (1995-08-01), Hopkins et al.
patent: 5479340 (1995-12-01), Fox et al.
patent: 5544256 (1996-08-01), Brecher et al.
patent: 6153115 (2000-11-01), Le et al.
patent: 6336082 (2002-01-01), Nguyen et al.
patent: 6442445 (2002-08-01), Bunkofske et al.
patent: 6453246 (2002-09-01), Agrafiotis et al.
patent: 6456899 (2002-09-01), Gleason et al.
patent: 6830939 (2004-12-01), Harvey et al.
patent: 6839655 (2005-01-01), Gross et al.
patent: 6917839 (2005-07-01), Bickford
patent: 6967899 (2005-11-01), O'Brien et al.
patent: 2004/0055888 (2004-03-01), Wikiel et al.
patent: 2004/0083065 (2004-04-01), Daniel et al.
patent: 2004/0116814 (2004-06-01), Stranc et al.
patent: 2004/0228186 (2004-11-01), Kadota
patent: 2005/0028932 (2005-02-01), Shekel et al.
patent: 2005/0037515 (2005-02-01), Nicholson et al.
patent: 2005/0045821 (2005-03-01), Noji et al.
patent: 2005/0130321 (2005-06-01), Nicholson et al.
Goodlin et al., “Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools,” 201stMeeting of the Electrochemical Society, International Symposium on Plasma Processing XIV, Abs. 413, Philadelphia, PA, May 2002 (16 pages).
Goodlin et al., “Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools,” Journal of the Electrochemical Society, 150 (12) G778-G784 (2003).
Gallagher et al., “Development and Benchmarking of Multivariate Statistical Process Control Tools for a Semiconductor Etch Process: Improving Robustness through Model Updating,” Eigenvector Research, Inc., (6 pgs.) first viewed at least Sep. 9, 2004.
Chen et al., “Plasma Etch Modeling using Optical Emission Spectroscopy,” J. Vac. Sci. Technol. A 14(3), May/Jun. 1996 (pp. 1901-1906).
Lymberopoulos et al., “Advanced Process Control Comes of Age,” Jul. 1, 2004 http://www.reed-electronics.com/semiconductor/index.asp?layout=articlePrint&article ID=... (pp. 1-6).
Skumanich et al., “Advanced Etch Applications Using Tool-Level Data,” Copyright 2005, PennWell Corporation, http://sst.pennet.com/articles/article—display.cfm?section=archi&article—id=206470&vers..., Jun. 2004 (pp. 1-7).
Mason et al., “Applying Hotelling's T2Statistic to Batch Processes,” Journal of Quality Technology, vol. 33, No. 4, Oct. 2001 (pp. 466-479).
Smith et al., “Process Leaps Without New Hardware,” European Semiconductor, The Source for Europe, Middle East and Africa, www.euroseml.eu.com, Nov. 2004 (4 pages).
“TOOLweb Blue Box Professional: Enabling High Speed, Multi-User Connectivity and Data Sharing,” Control & Information Technology, www.mksinst.com, Mar. 2005 (4 pages).
“TOOLweb SenseLink: Web-Enables Existing Sensors,” Control & Information Technology, www.mksinst.com, Dec. 2004 (4 pages).
“TOOLweb: APC & e-Diagnostics Suite,” Control & Information Technology, www.mksinst.com, Nov. 2004 (4 pages).
“TOOLweb Applications Support: AEC/APC Applications Engineering, Integration and Deployment Support,” Control & Information Technology, www.mksinst.com, Sep. 2005 (4 pages).
Smith et al., “From Sensor Data to Process Control: A Networked Framework,” Semiconductor Manufacturing Magazine, Jul. 2004 (6 pages).
Wold et al., “Modeling and Diagnostics of Batch Processes and Analogous Kinetic Experiments,” Chemometrics and Intelligent Laboratory Systems 44 (1998) (pp. 331-340).

Affiliated with

Also associated with

Rating

Method and apparatus for classifying manufacturing outputs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for classifying manufacturing outputs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for classifying manufacturing outputs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3865230