Method and apparatus for classifying a defect on a semiconductor

Image analysis – Applications – Manufacturing or product inspection

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382145, 382147, G06K 900

Patent

active

059434376

ABSTRACT:
A surface image of a semiconductor wafer having a defect is picked up as a inspection image while a surface image of a semiconductor wafer having no defect is stored in an image memory as a reference image. A density difference image between the inspection image and the reference image. By extracting the defect in wiring and non-wiring regions from the density difference image, extract images are obtained. Two luminance information for wiring and non-wiring regions are obtained from extract images. Based on the luminance information, the type of the defect is determined and a production process where the defect has occurred is detect.

REFERENCES:
patent: 5459795 (1995-10-01), Kawamura et al.
patent: 5544256 (1996-08-01), Brecher et al.

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