Image analysis – Applications – Manufacturing or product inspection
Patent
1996-10-07
1999-08-24
Couso, Jose L.
Image analysis
Applications
Manufacturing or product inspection
382145, 382147, G06K 900
Patent
active
059434376
ABSTRACT:
A surface image of a semiconductor wafer having a defect is picked up as a inspection image while a surface image of a semiconductor wafer having no defect is stored in an image memory as a reference image. A density difference image between the inspection image and the reference image. By extracting the defect in wiring and non-wiring regions from the density difference image, extract images are obtained. Two luminance information for wiring and non-wiring regions are obtained from extract images. Based on the luminance information, the type of the defect is determined and a production process where the defect has occurred is detect.
REFERENCES:
patent: 5459795 (1995-10-01), Kawamura et al.
patent: 5544256 (1996-08-01), Brecher et al.
Gotoh Yuichiro
Kanbe Shouji
Morimoto Tsutomu
Okamoto Akira
Sumie Shingo
Couso Jose L.
Dang Duy M.
Kabushiki Kaisha Kobe Seiko Sho
KTI Semiconductor Ltd.
Texas Instruments Japan Limited
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