Method and apparatus for clamping land grid array integrated cir

Details Method and apparatus for clamping land grid array integrated cir Method and apparatus for clamping land grid array integrated cir

1997-12-05

2000-10-24

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439331, G01R 3102

Patent

active

061372986

ABSTRACT:
The system and method of the present invention facilitate clamping of a land grid array integrated circuit (LGA IC) device through adjustment and calibration of the clamping system in relation to the connector/socket features used for a given type of LGA IC device and connector/socket. In order to accommodate for different connector/socket heights, the clamping system of the present invention includes exchangeable calibrated springs and an exchangeable shim that enable the clamping system to adjust to a specific connector/socket height. Due to the level of calibration, the system and method provides controlled downward vertical force at the level of force required to clamp the pads of the LGA IC device to the contacts of the connector/socket thereby providing complete electric contact therebetween and complete electric contact between the connector/socket and a circuit board. Further, a heat sink and the material content of the supporting structure provide dissipation and stabilization of heat generated by the processor during testing. Still further, the clamping system provides for expeditious replacement of the LGA IC device.

REFERENCES:
patent: 3942854 (1976-03-01), Klein et al.
patent: 3970934 (1976-07-01), Aksu
patent: 4456318 (1984-06-01), Shibata et al.
patent: 4553805 (1985-11-01), Aikens
patent: 5473510 (1995-12-01), Dozier, II
patent: 5648893 (1997-07-01), Loo et al.

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