Cleaning and liquid contact with solids – Apparatus – With spray or jet supplying and/or applying means
Reexamination Certificate
2004-12-22
2008-10-14
Stinson, Frankie L (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With spray or jet supplying and/or applying means
C134S902000
Reexamination Certificate
active
07434590
ABSTRACT:
An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficulties can arise under high pressure processes. Small deflections in even very thick metal support platens can lead to backside wafer wear, platen abrasion, and even breakage of semiconductor wafers. This invention discloses a method to eliminate the transfer of flexure inherent in high pressure vessel walls, yet still retain the vacuum chucking method.
REFERENCES:
patent: 2617719 (1952-11-01), Stewart
patent: 2625886 (1953-01-01), Browne
patent: 3744660 (1973-07-01), Gaines et al.
patent: 3968885 (1976-07-01), Hassan et al.
patent: 4029517 (1977-06-01), Rand
patent: 4091643 (1978-05-01), Zucchini
patent: 4245154 (1981-01-01), Uehara et al.
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4355937 (1982-10-01), Mack et al.
patent: 4367140 (1983-01-01), Wilson
patent: 4406596 (1983-09-01), Budde
patent: 4422651 (1983-12-01), Platts
patent: 4474199 (1984-10-01), Blaudszun
patent: 4522788 (1985-06-01), Sitek et al.
patent: 4549467 (1985-10-01), Wilden et al.
patent: 4592306 (1986-06-01), Gallego
patent: 4601181 (1986-07-01), Privat
patent: 4626509 (1986-12-01), Lyman
patent: 4670126 (1987-06-01), Messer et al.
patent: 4682937 (1987-07-01), Credle, Jr.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4778356 (1988-10-01), Hicks
patent: 4788043 (1988-11-01), Kagiyama et al.
patent: 4789077 (1988-12-01), Noe
patent: 4823976 (1989-04-01), White, III et al.
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4827867 (1989-05-01), Takei et al.
patent: 4838476 (1989-06-01), Rahn
patent: 4865061 (1989-09-01), Fowler et al.
patent: 4879431 (1989-11-01), Bertoncini
patent: 4917556 (1990-04-01), Stark et al.
patent: 4924892 (1990-05-01), Kiba et al.
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4960140 (1990-10-01), Ishijima et al.
patent: 4983223 (1991-01-01), Gessner
patent: 5011542 (1991-04-01), Weil
patent: 5013366 (1991-05-01), Jackson et al.
patent: 5044871 (1991-09-01), Davis et al.
patent: 5062770 (1991-11-01), Story et al.
patent: 5068040 (1991-11-01), Jackson
patent: 5071485 (1991-12-01), Matthews et al.
patent: 5105556 (1992-04-01), Kurokawa et al.
patent: 5143103 (1992-09-01), Basso et al.
patent: 5167716 (1992-12-01), Boitnott et al.
patent: 5169296 (1992-12-01), Wilden
patent: 5169408 (1992-12-01), Biggerstaff et al.
patent: 5185296 (1993-02-01), Morita et al.
patent: 5186594 (1993-02-01), Toshima et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5188515 (1993-02-01), Horn
patent: 5190373 (1993-03-01), Dickson et al.
patent: 5191993 (1993-03-01), Wanger et al.
patent: 5193560 (1993-03-01), Tanaka et al.
patent: 5195878 (1993-03-01), Sahiavo et al.
patent: 5213485 (1993-05-01), Wilden
patent: 5213619 (1993-05-01), Jackson et al.
patent: 5215592 (1993-06-01), Jackson
patent: 5217043 (1993-06-01), Novakovi
patent: 5221019 (1993-06-01), Pechacek et al.
patent: 5222876 (1993-06-01), Budde
patent: 5224504 (1993-07-01), Thompson et al.
patent: 5236602 (1993-08-01), Jackson
patent: 5236669 (1993-08-01), Simmons et al.
patent: 5237824 (1993-08-01), Pawliszyn
patent: 5240390 (1993-08-01), Kvinge et al.
patent: 5243821 (1993-09-01), Schuck et al.
patent: 5246500 (1993-09-01), Samata et al.
patent: 5251776 (1993-10-01), Morgan, Jr. et al.
patent: 5267455 (1993-12-01), Dewees et al.
patent: 5280693 (1994-01-01), Heudecker
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5304515 (1994-04-01), Morita et al.
patent: 5306350 (1994-04-01), Hoy et al.
patent: 5313965 (1994-05-01), Palen
patent: 5314574 (1994-05-01), Takahashi
patent: 5316591 (1994-05-01), Chao et al.
patent: 5328722 (1994-07-01), Ghanayem et al.
patent: 5337446 (1994-08-01), Smith et al.
patent: 5339844 (1994-08-01), Stanford, Jr. et al.
patent: 5355901 (1994-10-01), Mielnik et al.
patent: 5368171 (1994-11-01), Jackson
patent: 5370740 (1994-12-01), Chao et al.
patent: 5370741 (1994-12-01), Bergman
patent: 5377705 (1995-01-01), Smith, Jr. et al.
patent: 5401322 (1995-03-01), Marshall
patent: 5403621 (1995-04-01), Jackson et al.
patent: 5404894 (1995-04-01), Shiraiwa
patent: 5412958 (1995-05-01), Iliff et al.
patent: 5417768 (1995-05-01), Smith, Jr. et al.
patent: 5433334 (1995-07-01), Reneau
patent: 5447294 (1995-09-01), Sakata et al.
patent: 5456759 (1995-10-01), Stanford, Jr. et al.
patent: 5494526 (1996-02-01), Paranjpe
patent: 5500081 (1996-03-01), Bergman
patent: 5501761 (1996-03-01), Evans et al.
patent: 5503176 (1996-04-01), Dummire et al.
patent: 5505219 (1996-04-01), Lansberry et al.
patent: 5509431 (1996-04-01), Smith, Jr. et al.
patent: 5522938 (1996-06-01), O'Brien
patent: 5526834 (1996-06-01), Mielnik et al.
patent: 5533538 (1996-07-01), Marshall
patent: 5571330 (1996-11-01), Kyogoku
patent: 5589224 (1996-12-01), Tepman et al.
patent: 5621982 (1997-04-01), Yamashita et al.
patent: 5629918 (1997-05-01), Ho et al.
patent: 5644855 (1997-07-01), McDermott et al.
patent: 5649809 (1997-07-01), Stapelfeldt
patent: 5656097 (1997-08-01), Olesen et al.
patent: 5669251 (1997-09-01), Townsend et al.
patent: 5672204 (1997-09-01), Habuka
patent: 5683977 (1997-11-01), Jureller et al.
patent: 5702228 (1997-12-01), Tamai et al.
patent: 5706319 (1998-01-01), Holtz
patent: 5746008 (1998-05-01), Yamashita et al.
patent: 5769588 (1998-06-01), Toshima et al.
patent: 5797719 (1998-08-01), James et al.
patent: 5798126 (1998-08-01), Fujikawa et al.
patent: 5817178 (1998-10-01), Mita et al.
patent: 5868856 (1999-02-01), Douglas et al.
patent: 5868862 (1999-02-01), Douglas et al.
patent: 5881577 (1999-03-01), Sauer et al.
patent: 5882165 (1999-03-01), Maydan et al.
patent: 5888050 (1999-03-01), Fitzgerald et al.
patent: 5898727 (1999-04-01), Fujikawa et al.
patent: 5900107 (1999-05-01), Murphy et al.
patent: 5900354 (1999-05-01), Batchelder
patent: 5904737 (1999-05-01), Preston et al.
patent: 5906866 (1999-05-01), Webb
patent: 5908510 (1999-06-01), McCullough et al.
patent: 5928389 (1999-07-01), Jevtic
patent: 5932100 (1999-08-01), Yager et al.
patent: 5934856 (1999-08-01), Asakawa et al.
patent: 5934991 (1999-08-01), Rush
patent: 5955140 (1999-09-01), Smith et al.
patent: 5975492 (1999-11-01), Brenes
patent: 5976264 (1999-11-01), McCullough et al.
patent: 5979306 (1999-11-01), Fujikawa et al.
patent: 5980648 (1999-11-01), Adler
patent: 5981399 (1999-11-01), Kawamura et al.
patent: 5989342 (1999-11-01), Ikeda et al.
patent: 6005226 (1999-12-01), Aschner et al.
patent: 6017820 (2000-01-01), Ting et al.
patent: 6024801 (2000-02-01), Wallace et al.
patent: 6029371 (2000-02-01), Kamikawa et al.
patent: 6035871 (2000-03-01), Eui-Yeol
patent: 6037277 (2000-03-01), Masakara et al.
patent: 6053348 (2000-04-01), Morch
patent: 6056008 (2000-05-01), Adams et al.
patent: 6067728 (2000-05-01), Farmer et al.
patent: 6077053 (2000-06-01), Fujikawa et al.
patent: 6077321 (2000-06-01), Adachi et al.
patent: 6082150 (2000-07-01), Stucker
patent: 6085935 (2000-07-01), Malchow et al.
patent: 6097015 (2000-08-01), McCullough et al.
patent: 6110232 (2000-08-01), Chen et al.
patent: 6122566 (2000-09-01), Nguyen et al.
patent: 6128830 (2000-10-01), Bettcher et al.
patent: 6145519 (2000-11-01), Konishi et al.
patent: 6149828 (2000-11-01), Vaartstra
patent: 6159295 (2000-12-01), Maskara et al.
patent: 6164297 (2000-12-01), Kamikawa
patent: 6186722 (2001-02-01), Shirai
patent: 6203582 (2001-03-01), Berner et al.
patent: 6216364 (2001-04-01), Tanaka et al.
patent: 6228563 (2001-05-01), Starov et al.
patent: 6235634 (2001-05-01), White et al.
patent: 6239038 (2001-05-01), Wen
patent: 6241825 (2001-06-01), Wytman
patent: 6242165 (2001-06-01), Vaartstra
patent: 6244121 (2001-06-01), Hunter
patent: 6251250 (2001-06-01), Keigler
patent: 6277753 (2001-08-01), Mullee et al.
patent: 6286231 (2001-09-01), Bergman et al.
patent: 6305677 (2001-10-01), Lenz
paten
Stinson Frankie L
Tokyo Electron Limited
Wood Herron & Evans L.L.P.
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