Method and apparatus for chip placement

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29740, 29759, 29720, 414730, 901 40, 901 47, H05K 330, B23P 1900

Patent

active

049809717

ABSTRACT:
A system (10) for precisely placing a semiconductor chip (16) on a substrate (11) includes a robotic arm (18) which is provided with a gripper (22) for separately picking up the chip and substrate. A first television camera (38) is carried by the robotic arm and serves to capture the image of the substrate to locate a pair of datum points (71a and 71b) thereon. A second camera (40), stationary with respect to the robotic arm, serves to capture the image of the chip (16), when engaged by the robot, to locate each of a pair of datum points (83a and 83b) thereon. A machine vision system (46) serves to process the output signal of the cameras (38) and (40) to establish the precise location of the datum points on the substrate and on the chip. The information from the vision system (46) is employed to control the robotic arm to cause the gripper to place the chip on the substrate such that each of the datum points on the substrate is at a prescribed location relative to a separate one of the datum points on the chip.

REFERENCES:
patent: 3808063 (1986-02-01), Haley
patent: 4598456 (1986-07-01), McConnell
patent: 4628964 (1986-12-01), McConnell
patent: 4639878 (1987-01-01), Day et al.
patent: 4654949 (1987-04-01), Pryor
patent: 4668895 (1987-05-01), Schneiter
patent: 4675993 (1987-06-01), Harada
patent: 4705081 (1987-11-01), Birk et al.
patent: 4731860 (1988-03-01), Wahl
patent: 4738025 (1988-04-01), Arnold
patent: 4754415 (1988-06-01), George et al.
patent: 4755053 (1988-07-01), Levinson et al.
patent: 4772128 (1988-09-01), Vinarub et al.
patent: 4782273 (1988-11-01), Moynagh
patent: 4788440 (1988-11-01), Pryor
patent: 4791482 (1988-12-01), Barry et al.
patent: 4795913 (1989-01-01), Blessing et al.
patent: 4796200 (1989-01-01), Pryor
patent: 4808064 (1989-02-01), Bartholet
K. Kearney, "Assembly Automation Accommodates Advanced VLSI Packaging", Semiconductor International , Nov. 1988, p. 38.
M. K, Bartschat, "An Automated Flip-Chip Assembly Technology for Advanced VLSI Packaging," Conference Proceedings, 38th Electronics Components Conference, Los Angeles, Calif., May, 1988, pp. 335-341.
F. J. M. van der Heijden, "Assembly of Small Components by a Vision-Controlled Robot Using the Philips Vision System PAPS," Proceedings of the Fifth International Conference on Robot Vision and Sensory Controls, Oct. 29, 31, 1985, IFS Ltd., Kempston, England, pp. 517-528.
A.-R. Mansouri and A. Malowany, "Using Vision Feedback in Printed-Circuit Board Assembly," 1985 IEEE Microprocessor Forum: Design Productivity through Engineering Workstations, Apr. 2-4, 1985, IEEE, New York, N.Y., pp. 115-122.

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