Method and apparatus for chemical mechanical polishing

Details Method and apparatus for chemical mechanical polishing Method and apparatus for chemical mechanical polishing

2007-06-12

2007-06-12

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S285000, C451S527000

Reexamination Certificate

active

11320608

ABSTRACT:
A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly formed, for generating a dynamic pressure by rotation; a polishing table to which the polishing pad is adhered; a wafer provided at a predetermined interval from the polishing pad; a polishing head, on which the wafer is mounted, for driving the wafer; and a slurry supplier for providing slurry to a surface of the polishing pad.

REFERENCES:
patent: 6159088 (2000-12-01), Nakajima
patent: 6729950 (2004-05-01), Park et al.
patent: 2002/0068516 (2002-06-01), Chen et al.
patent: 2004/0058630 (2004-03-01), Park et al.

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