Method and apparatus for chemical-mechanical polishing

Details Method and apparatus for chemical-mechanical polishing Method and apparatus for chemical-mechanical polishing

1996-11-13

1999-08-24

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

457285, 457286, 457287, 451 41, B24B 500

Patent

active

059417587

ABSTRACT:
A method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. To promote uniform polishing, a multiple pressure zone back pressure wafer carrier is used to apply different pressures to different portions of the backside of the substrate, forcibly pressing the substrate against the polishing pad with pneumatic or hydraulic pressure during polishing.

REFERENCES:
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5588902 (1996-12-01), Tominaga et al.
patent: 5605488 (1997-02-01), Ohashi et al.

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