Method and apparatus for chemical/mechanical polishing

Details Method and apparatus for chemical/mechanical polishing Method and apparatus for chemical/mechanical polishing

1996-05-20

1998-04-07

Dang, Thi

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, 451287, 451532, 216 88, 216 89, B24D 1700, H01L 2100

Patent

active

057364630

ABSTRACT:
A method and apparatus for chemical/mechanical polishing in which an object to be polished, such as a wafer, is polished by pressing a polishing pad on the object and rotating the polishing pad relative to the object while supplying a slurry to the object, wherein the polishing pad contains a shape memory material. This is effective to easily repair the polishing pad for a short period of time, and hence to increase the productivity in manufacture of ICs or the like.

REFERENCES:
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5456736 (1995-10-01), Waki et al.

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