Method and apparatus for chemical and mechanical polishing

Details Method and apparatus for chemical and mechanical polishing Method and apparatus for chemical and mechanical polishing

2005-11-29

2005-11-29

Rachuba, M. (Department: 3723)

Abrading

Machine

Combined

C205S123000, C205S662000, C205S663000, C205S093000, C438S692000, C438S693000, C451S285000, C451S067000

Reexamination Certificate

active

06969308

ABSTRACT:
A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.

REFERENCES:
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6368190 (2002-04-01), Easter et al.
patent: 6478936 (2002-11-01), Volodarsky et al.
patent: 2004/0000486 (2004-01-01), Preusse
patent: 2004/0166789 (2004-08-01), Ashjaee et al.
patent: 2004/0171269 (2004-09-01), Kondo et al.
patent: 2004/0198190 (2004-10-01), Basol et al.
patent: 62-136317 (1987-06-01), None
patent: WO 02/17411 (2002-02-01), None

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