Method and apparatus for changing sputtering targets in a magnet

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204298, C23C 1500

Patent

active

045198853

ABSTRACT:
A method and apparatus for changing rotatable magnetron sputtering targets is disclosed in which the new target is contained within one of a pair of holding chambers which can be alternately moved into alignment with the axis of the target contained in the sputtering chamber. The empty receiving chamber is aligned with the target to be removed and the target is withdrawn into the receiving chamber after both holding or receiving chambers have been pumped down to a vacuum near that of the sputtering chamber. With the old target in one of the chambers, both chambers are shifted to place the receiving chamber with the new target into position in alignment with the axis of the sputtering chamber. The new target is inserted into the sputtering chamber from the holding chamber without loss of vacuum in the sputtering chamber so that sputtering can be resumed without being contaminated by changing targets. The sputtering chamber holds the target, in the form of a cylinder, with one end extending through the wall thereof for facilitating the rotation thereof and the cooling of the interior while maintaining the magnets for enhancement purposes stationary within the hollow target. Once the new target is in place, both receiving chambers are brought to atmospheric pressure and may be opened for the purpose of replacing the old target with a fresh one for the next exchange procedure.

REFERENCES:
patent: 3894926 (1975-07-01), Lee
patent: 3933644 (1976-01-01), Skinner et al.
patent: 4204936 (1980-05-01), Hartsough
patent: 4294678 (1981-10-01), Kuehnle
patent: 4356073 (1982-10-01), McKelvey

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