Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2007-08-28
2007-08-28
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S462000, C225S096500
Reexamination Certificate
active
11213015
ABSTRACT:
An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.
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Baylis William H.
Tyler John E.
Dynatex International
Nguyen Tuan H.
Young Barry N.
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