Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2007-12-26
2011-10-11
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S462000, C438S463000, C438S464000, C438S465000, C225S096500, C225S103000
Reexamination Certificate
active
08034653
ABSTRACT:
A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downward from a position above the semiconductor substrate placed on the table to thereby compress a portion of the semiconductor substrate outside the predetermined area so that the semiconductor substrate is broken along the split groove. The predetermined area of the semiconductor substrate has at least a neighboring pair of sides intersecting at an angle of less than 180 degrees, and the breaking blade has a projection which, when the semiconductor substrate is broken, compresses a portion of the semiconductor substrate outside the one side so that the one side is compressed ahead of the other side.
REFERENCES:
patent: 4775085 (1988-10-01), Ishizuka et al.
patent: 6962279 (2005-11-01), Marek et al.
patent: 2005/0196899 (2005-09-01), Shimizu et al.
patent: 2005/0259459 (2005-11-01), Nagai et al.
patent: 2007/0261731 (2007-11-01), Abe et al.
patent: 62-105446 (1987-05-01), None
patent: 1-178408 (1989-07-01), None
patent: 2-127003 (1990-05-01), None
patent: 2-179708 (1990-07-01), None
patent: 9-148601 (1997-06-01), None
patent: 2003-286044 (2003-10-01), None
patent: 2004-031839 (2004-01-01), None
patent: 2005-79526 (2005-03-01), None
patent: 2005-236017 (2005-09-01), None
patent: 2006-253417 (2006-09-01), None
patent: WO 2004/081992 (2004-09-01), None
Extended European Search Report for corresponding EP Application No. 07025018.8-1528, dated Oct. 14, 2010, pp. 1-7.
Dehne Aaron
Ditthavong Mori & Steiner, P.C.
Nguyen Ha Tran T
Sanyo Electric Co,. Ltd.
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