Method and apparatus for bonding with consistent uniform bond th

Details Method and apparatus for bonding with consistent uniform bond th Method and apparatus for bonding with consistent uniform bond th

1988-05-20

1989-08-15

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

29740, B23K 102

Patent

active

048571334

ABSTRACT:
A method and apparatus are disclosed for bonding a semiconductor die to a semiconductor circuit package base with silver glass paste. Consistent and uniform bond thickness is achieved by first positioning the die so that it is in contact with the package base and recording this position, then offsetting the position of the die a measured distance from the recorded position using a micrometer.

REFERENCES:
patent: 4393579 (1983-07-01), Van Hooreweder
patent: 4598853 (1986-07-01), Hill
patent: 4720035 (1988-01-01), Isogai
patent: 4762578 (1988-08-01), Burgin
Memorandum of Apr. 28, 1986 from Johnson Matthey Inc.
Processing Guidelines JM 4613 and JM 4720 from Johnson Matthey Inc.
Technical Service Bulletin of Jul. 1, 1986 from Johnson Matthey Inc.

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