Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent
1998-03-11
2000-12-12
Ryan, Patrick
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
228205, 228 42, B23K 120, B23K 3102
Patent
active
06158648&
ABSTRACT:
High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.
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Anan Makoto
Asano Yasuhiko
Kurashima Yohei
Kurashina Osamu
Miyakawa Takuya
Edmondson L.
Ryan Patrick
Seiko Epson Corporation
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