Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1995-03-30
1997-08-26
Bradley, P. Austin
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 45, B23K 2010, B23K 3102
Patent
active
056603169
ABSTRACT:
A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is available. The apparatus includes a supporting structure, a mechanism for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage, The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.
REFERENCES:
patent: 4838472 (1989-06-01), Scavino
patent: 5158223 (1992-10-01), Shimizu
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5340011 (1994-08-01), Sanchez
Bradley P. Austin
Knapp Jeffrey T.
Morris James H.
SGS--Thomson Microelectronics S.r.l.
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