Method and apparatus for bonding semiconductor electronic device

Metal fusion bonding – Process – Plural joints

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2281101, B23K 3102, B23K 3747

Patent

active

057354499

ABSTRACT:
A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is disclosed. The apparatus includes a supporting structure, a conveyor for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage. The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.

REFERENCES:
patent: 4838472 (1989-06-01), Scavino
patent: 4893742 (1990-01-01), Pullock
patent: 5158223 (1992-10-01), Shimizu
patent: 5251805 (1993-10-01), Tani et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5340011 (1994-08-01), Sanchez
European Search Report from Patent Application 94830155.1, filed March 31, 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for bonding semiconductor electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for bonding semiconductor electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for bonding semiconductor electronic device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-6211

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.