Method and apparatus for bonding semiconductor electronic device

Details Method and apparatus for bonding semiconductor electronic device Method and apparatus for bonding semiconductor electronic device

1997-04-04

1998-04-07

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

2281101, B23K 3102, B23K 3747

Patent

active

057354499

ABSTRACT:
A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is disclosed. The apparatus includes a supporting structure, a conveyor for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage. The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.

REFERENCES:
patent: 4838472 (1989-06-01), Scavino
patent: 4893742 (1990-01-01), Pullock
patent: 5158223 (1992-10-01), Shimizu
patent: 5251805 (1993-10-01), Tani et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5340011 (1994-08-01), Sanchez
European Search Report from Patent Application 94830155.1, filed March 31, 1994.

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