Method and apparatus for bonding metal wire to a base metal subs

Details Method and apparatus for bonding metal wire to a base metal subs Method and apparatus for bonding metal wire to a base metal subs

1980-07-09

1984-03-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, C25D 502, C25D 508

Patent

active

044379439

ABSTRACT:
A process and apparatus for bonding lead wires to a metal substrate. A lead wire is positioned on the substrate and a spot of metal is deposited over a portion of the lead wire and metal substrate to firmly bond the wire to the substrate.

REFERENCES:
patent: 2750332 (1956-06-01), Miller
patent: 3071521 (1963-01-01), Ehrhart
patent: 3263057 (1966-07-01), Conti
patent: 3468785 (1969-09-01), Polichette
patent: 3810829 (1974-05-01), Fletcher
patent: 3894918 (1975-07-01), Corby
patent: 3957614 (1976-05-01), Corby
patent: 4033833 (1977-07-01), Bestel
patent: 4037772 (1977-07-01), Dupuis
The Welding Encyclopedia, Thirteenth Edition, 1951, p. 367.

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