Method and apparatus for bonding and debonding adhesive...

Details Method and apparatus for bonding and debonding adhesive... Method and apparatus for bonding and debonding adhesive...

2011-03-08

2011-03-08

Osele, Mark A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S275500, C156S345420, C523S440000

Reexamination Certificate

active

07901532

ABSTRACT:
The present invention relates to a system and a method of improving the debonding of two or more surfaces together. The invention utilises thermoexpanadable microspheres and thermal energy to debond interfaces in an adhesive system or as vehicle carriers. It also discloses a method of curing the adhesive system prior to the debonding step so that the same adhesive system may be used for both phases. It is especially useful in the automotive industry for end of vehicle life dismantling.

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patent: 1 126 001 (2001-08-01), None
patent: WO 98/50480 (1998-11-01), None
patent: WO 00/75254 (2000-12-01), None
International Search Report, PCT/GB2004/001366, Dec. 17, 2004.

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