Method and apparatus for bonding and breaking leads to semicondu

Details Method and apparatus for bonding and breaking leads to semicondu Method and apparatus for bonding and breaking leads to semicondu

1974-09-30

1976-05-04

Jones, Jr., James L.

Metal fusion bonding

Process

Using high frequency vibratory energy

228 1, B23K 106

Patent

active

039542173

ABSTRACT:
The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a "tailless" wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.

REFERENCES:
patent: 3087239 (1963-04-01), Clagett
patent: 3627192 (1971-12-01), Killingsworth

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