Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2005-05-17
2005-05-17
Cooke, Colleen P. (Department: 1754)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S180500, C228S230000, C228S004500, C219S121600, C219S121850
Reexamination Certificate
active
06892927
ABSTRACT:
A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the temperature that is higher than the temperature of the device. The bond head is subsequently moved toward the device to bring a portion of the wire into contact with the bond pad. Ultrasonic energy is provided to an interface between the portion of the wire and the bond pad.
REFERENCES:
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 5079070 (1992-01-01), Chalco et al.
patent: 5251805 (1993-10-01), Tani et al.
patent: 5298715 (1994-03-01), Chalco et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 6478212 (2002-11-01), Engel et al.
patent: 6520399 (2003-02-01), Salzer et al.
patent: 6715660 (2004-04-01), Seki et al.
patent: 6729528 (2004-05-01), Seki et al.
patent: 59172732 (1984-09-01), None
patent: 63078543 (1988-04-01), None
Clemons Gregory S.
Rumer Christopher L.
Blakely , Sokoloff, Taylor & Zafman LLP
Cooke Colleen P.
LandOfFree
Method and apparatus for bonding a wire to a bond pad on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for bonding a wire to a bond pad on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for bonding a wire to a bond pad on a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3454891