Method and apparatus for batch solder bumping of chip carriers

Details Method and apparatus for batch solder bumping of chip carriers Method and apparatus for batch solder bumping of chip carriers

1984-11-07

1985-12-17

Lin, Kuang Y.

Metal fusion bonding

Process

Plural joints

228 62, 228 47, 228 491, 228221, B23K 3102

Patent

active

045588120

ABSTRACT:
Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39).

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