Method and apparatus for back side damage of silicon wafers

Details Method and apparatus for back side damage of silicon wafers Method and apparatus for back side damage of silicon wafers

1981-03-22

1993-03-30

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51216T, 51 7, 211 41, 211164, 211 78, B24B 104

Patent

active

051972719

ABSTRACT:
A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.

REFERENCES:
patent: 3226254 (1965-12-01), Reuschel
patent: 3486631 (1969-12-01), Rodman
patent: 3610613 (1971-10-01), Worden
patent: 3679517 (1973-07-01), Schulten et al.
patent: 3899815 (1975-06-01), Merle
patent: 4718202 (1988-01-01), Worsham
patent: 4966549 (1990-10-01), Ohdate

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