Method and apparatus for avoiding particle accumulation in...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...

Reexamination Certificate

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C205S205000, C205S206000, C205S220000, C205S221000, C205S222000, C205S223000, C205S640000, C205S660000, C205S662000, C451S056000, C451S072000

Reexamination Certificate

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06932896

ABSTRACT:
Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.

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patent: 0 421 350 (1991-04-01), None
patent: 1 103 346 (2001-05-01), None
patent: WO 99/26758 (1999-06-01), None
patent: WO 00/26443 (2000-05-01), None

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