Method and apparatus for automatically positioning electronic di

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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3241581, B65G 4907, G01R 3126, H01L 2166

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active

061508284

ABSTRACT:
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

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