Method and apparatus for automatically loading a...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C451S006000, C451S008000, C451S041000, C451S059000, C451S063000, C451S261000, C451S262000, C451S339000

Reexamination Certificate

active

06843704

ABSTRACT:
A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.

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patent: 195 47 086 (1997-06-01), None
patent: 100 07 389 (2001-05-01), None

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