Method and apparatus for automatically checking position data of

Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed

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438 14, 438 15, G01R 3126, H01L 2166

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active

059406810

ABSTRACT:
There is disclosed a method for automatically checking position data of J-leads at a semiconductor component enclosed in a housing with respect to a plane parallel to the bottom side of the housing. The bottom side of the housing is illuminated by light from an illuminator at at least one reproducible angle. The light reflected from the bottom side of the housing and the leads at essentially right angles is picked up by a camera with high resolution. The image signals of the camera are fed to an image signal processing device, and at least one data record with an indicator assigned to the semiconductor component is stored. From the image signals, position data of the leads are determined. Any deviation of the position data from predetermined nominal values is determined by comparing the position data with reference data.

REFERENCES:
German Search Report for 196 52 124.6, dated Aug. 8, 1997.

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