Coating processes – Electrical product produced – Metal coating
Patent
1990-09-24
1992-04-14
Beck, Shrive
Coating processes
Electrical product produced
Metal coating
427 96, 118323, 118696, C23C 2600
Patent
active
051046890
ABSTRACT:
The method and apparatus of the present invention permits the automated deposition of heated solder onto a plurality of conductive pads which are disposed in one or more linear arrays on a circuit board or other planar member. A robotically controlled arm is utilized to mount a solder nozzle and selectively manipulate the solder nozzle over the circuit board. The solder nozzle is first manipulated to a selected point offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points or other areas which do not require solder deposition.
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Hayden Terry F.
Hicks Christopher A.
Pooler Rodney A.
Beck Shrive
Dang Vi Duong
Dillon Andrew J.
International Business Machines - Corporation
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